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Home > SOLDERING & REWORK > SOLDER PASTE
AIM NC520 Solder Paste (T4) (Lead-Free) IPC Spec : ROL0
No-Clean Solder Paste - 500g Jar
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AIM NC520 Solder Paste (T4) (Lead-Free) IPC Spec : ROL0

Part Number SAC520NC-T4-5J
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Your Price:
$90.00
Quantity
Description
NC520 is designed for the most demanding high density electronic assemblies. NC520 has been developed to offer excellent wetting, improved printing and to reduce voiding. The superior wetting ability of NC520 results in bright, smooth and shiny solder joints with SAC alloys. An innovative activator system offers excellent wetting in a wide range of profiles. Enhanced wetting will reduce voiding on QFN ground planes, LGA and BGA interconnects. NC520 consistent transfer efficiencies reduce head-in-pillow (HiP) even when component/substrate co-planarity is not optimal.
 
 IPC flux specification for this material is ROL0.
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