M8 brings no-clean solder paste performance to the next level. Developed in combination with T4 and finer mesh lead-free alloy powders, M8 provides stable transfer efficiencies required for today's challenging applications. A novel activator system provides powerful, durable wetting action accommodating a wide range of profiling processes and techniques. M8 activators will reduce wetting related defects, such as HiP (head-in-pillow) and provides smooth shiny joints. M8 has reduced BGA and BTC voiding to as low as <5% on BGA and <10% on BTC ground pads. M8 residues can remain on the assembly after reflow and do not require cleaning. Where cleaning is mandated, AIM has worked closely with industry partners to ensure that M8 Residues can be effectively removed with common defluxing agents.
*Price Listed Is For One 500g Jar!
M8 Features :
-Low Voiding : <5% on BGA and >10% on BTC Components
-Excellent Print Transfer Efficiencies on 01005 Components
-Eliminates HiP (Head-In-Pillow) Defects
-REACH and RoHS Compliant
-Formulated for use with T4 and Finer Powders
-Powerful Wetting on Lead-Free Surface Finishes
-Approved for use with MPM Enclosed Flow
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