AIM SAC257 No-Clean Solder Paste (T3) (Lead-Free) IPC Spec : REL0

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NO-CLEAN SOLDER PASTE LEAD-FREE SAC257-2NC-5J

Part Number: SAC257-2NC-5J

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Description

NO-CLEAN SOLDER PASTE LEAD-FREE SAC257-2

• RoHS Compliant

• Broad Printing Process Window

• 24 Hour Stencil Life

• Excellent Wetting

• 12-24 Hour Tack Time

• Reduces Voiding Under Micro-BGA’s

SAC257-2 has been developed to offer an extremely broad process window for printing, wetting and pin-probe testing. The superior wetting ability of SAC257-2 results in bright, smooth and shiny solder joints. This product has been specifically formulated to lower solder beading. It also offers very low post process residues, which remain crystal clear and easily probed even at the elevated temperatures for today’s lead-free alloys. This solder paste offers a chemistry developed for use in air reflow, as well as providing slump and humidity tolerances to extend the useful life in facilities where environmental control is not at its optimum. SAC257-2 can be cleaned if necessary with saponified water or an appropriate solvent cleaner.

IPC Flux specification for this material is REL0

http://www.aimsolder.co.il/_Uploads/dbsAttachedFiles/NC257-2SAC305rev9.pdf

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AIM SAC257 No-Clean Solder Paste (T3) (Lead-Free) IPC Spec : REL0

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