Solder Paste

AIM SAC258 No-Clean Solder Paste (T4) (Lead-Free) IPC Spec : REL0

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No-Clean Solder Paste SAC258NC-T4-5J

Part Number: SAC258NC-T4-5J

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Description

NO-CLEAN SOLDER PASTE NC258

Aim Solder has announced a new No-Clean solder paste that offers many advanced features and benefits. Extensive testing has been done on this product and it is highly recommended as your primary no-clean solder paste.

NC258 has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. NC258 reduces defects such as voiding and head-in-pillow. The superior wetting ability of NC258 results in bright, smooth and shiny solder joints. It also offers very low post process residues which remain crystal clear even at the elevated temperatures required for today’s lead-free alloys. NC258 can be cleaned if necessary with saponified water or an appropriate solvent cleaner.

Features and Benefits

Best printing and most robust solder paste ever developed by AIM
Best-in-class pause-to-print capabilities
Enhances fine print definitions
Reduced head-in-pillow
Good wetting, even leadless devices
Very good void reduction
Lead-Free compatible
The viscosity remains stable over long periods of time at room temperature
RoHS Compatible

IPC flux specification for this material is RELO.

SDS (Safety Data Sheet) SAC258 No-Clean Solder Paste

TDS (Technical Data Sheet) SAC258 No-Clean Solder Paste

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AIM SAC258 No-Clean Solder Paste (T4) (Lead-Free) IPC Spec : REL0

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