WATER SOLUBLE SOLDER PAST TIN/LEAD WS483
• 48 Hour Stencil Life
• Excellent Activity
• 24 Hour Tack Time
• Excellent Printing Characteristics
• Slump Resistant
• Extended Cleaning Window
• Will Not Foam During Wash
WS483 is an organically activated formulation developed to better resist the effects of increased humidity levels. This paste offers improved heat and humidity resistance, while maintaining high tack and resistance to slump. WS483 also provides an exceptional post-process cleaning window and will not foam during the cleaning process, even in high-pressure wash systems.
WS483 can be cleaned easily with normal tap water. Deionized water is recommended for the final rinse. A temperature of (100°F - 150°F) is sufficient for removing residues.
IPC Flux specification for this material is ORM0
