AIM 688-10CC One-Step Underfill 688 (10CC Syringe)

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Your Price: $750.00

Part Number: 688-10CC

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Quantity

Description

*All 688-10CC Syringes Are Sold In Case Quantity [10 Syringes p/cs]

Priced Above In Case Quantity

The 688-10CC is a low surface tension, One-Step Underfill. This single component epoxy resin is designed as a one-step no-flow underfill for flip chip, CSP, BGA and micro-BGA assemblies. The 688 improves product reliability through high Tg, low CTE and good fill with no voiding. This Underfill does not require flux, though it is compatible with no-clean flux residues. Providing excellent adhesion, the 688 can be directly dispensed following the solder paste printing process. Once complete, components are placed, and the entire assembly is reflowed and cured simultaneously in a standard Lead-Free reflow process. This eliminates the need for a second assembly process and separate cure cycle. The 688 offers excellent capillary action, fast reflow characteristics and fast cure speeds. The low viscosity and excellent wetting properties allow the material to "Self-Fillet" along the edges of a die. For larger pads, multiple dots or "X" patterns may be required to ensure complete coverage. The 688 One-Step Underfill may be reworked when needed. Re-heat the underfill to 248°F (120°C) and the viscosity of the product remains stable throughout its shelf life. The 688 has a 2-month work life when stored at 41°F (5°C) (Refrigerated) or 3 months when stored at 32°F (0°C) (Frozen). The 688 Underfill wets solder to OSP, ENIG, Immersion Silver and Immersion Tin Board Surfaces.

688-10CC Specifications:

Physical Properties:

Appearance: Purple (Un-Cured); Clear (Cured)
CTE (Before Tg): 62.7 ppm
CTE (After Tg): 174.6 ppm
Tg: 64.1 C
Total Volatiles: < 1%
Specific Gravity [@ 77°F (25°C)]: 1.27 g/cc

*For A Complete Specification List Click Here

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